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产品线1-通讯设备(数据中心112Gbps应用) - V3-1-5产品图.jpg
产品线1-通讯设备(数据中心112Gbps应用) - V3-1-5产品图.jpg
Tele/Datacom(112Gbps Application)
Product application

Tele/Datacom(112Gbps Application)

Product design

Layer Count:  18L


Material:  Tachyon-100G


Board Thk:  2.6mm

 

Array Size:  164 mm x 244 mm


Min Line Width/Spacing:  112um/114um


Min Drill Bit size:  0.2mm


Aspect Ratio:  12:1


Surface Treatment:  OSP


N+N Structure, POFV


Product display
Product stacking